social media relationships are so weird.
like i know that yall aren’t my friends, but i still see stuff and think like “oh that user’s gonna love that one” or “i hope they have something neat to say about this.” you can say a lot about the dangers of attaching too many expectations to strangers and generally feeling overly-familiar about people you really don’t know, but i think it’s really neat how social media has made is so much easier to say like “oh, that’s a human person, not just an object in my periphery. hello human person! i love you!”
7 notes · View notes
The corresponding chip electrode pad surface adopts
The surface of the led street light suppliers pad of the corresponding chip is AuSn structure. Specifically, flux is applied to the corresponding pad position of the substrate, and then the chip is fixed, and then according to a certain temperature The curve is cured at high temperature. In the process, due to the eutectic temperature limitation of the AuSn material itself,
the highest temperature is usually around 320℃, which requires high temperature stability for chip structure and auxiliary materials, but it avoids the problem of solder paste control in small scales. . In addition to the above two methods, another tin plating process currently used in the IC integrated packaging process combines the advantages of the above two methods. The corresponding chip electrode pad surface adopts the Sn structure, and the specific needs are corresponding to the substrate.
Apply flux to the pad position, then fix the chip, and then perform high temperature curing according to a certain temperature curve. The temperature is similar to conventional reflow soldering. The SnAg composition on the surface of the chip electrode pad determines the temperature used for curing.
The current commonly used temperature is 240 ℃ On the one hand, this method avoids the problem of precise control in the case of solder paste, on the other hand, the curing temperature is relatively low, but the chip manufacturing process is relatively complicated, and the chip structure has a greater impact on the final effect. Considering the impact of the above three methods on the chip and packaging effect, this article uses three methods to make MiniLED chips of the same size, and then solder the chip and the substrate according to the corresponding temperature curve required for soldering, and then test and analyze the appearance, performance,
Not Quite Summer
It’s still a little rainy and cool, which is quite nice, but I’m missing winter already. So I dug through some old photographs to find pictures of one of the rare big snows in Tokyo.
It was big for Tokyo, anyway.
A glance to the right should show you “Angel’s Tale” by Hyde, one of the warmest winter songs ever. If you like a bluesy romantic, song, it’ll be right up your alley.
You drove the…
View On WordPress
1 note · View note