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The corresponding chip electrode pad surface adopts

The surface of the led street light suppliers pad of the corresponding chip is AuSn structure. Specifically, flux is applied to the corresponding pad position of the substrate, and then the chip is fixed, and then according to a certain temperature The curve is cured at high temperature. In the process, due to the eutectic temperature limitation of the AuSn material itself,

the highest temperature is usually around 320℃, which requires high temperature stability for chip structure and auxiliary materials, but it avoids the problem of solder paste control in small scales. . In addition to the above two methods, another tin plating process currently used in the IC integrated packaging process combines the advantages of the above two methods. The corresponding chip electrode pad surface adopts the Sn structure, and the specific needs are corresponding to the substrate.

Apply flux to the pad position, then fix the chip, and then perform high temperature curing according to a certain temperature curve. The temperature is similar to conventional reflow soldering. The SnAg composition on the surface of the chip electrode pad determines the temperature used for curing.

The current commonly used temperature is 240 ℃ On the one hand, this method avoids the problem of precise control in the case of solder paste, on the other hand, the curing temperature is relatively low, but the chip manufacturing process is relatively complicated, and the chip structure has a greater impact on the final effect. Considering the impact of the above three methods on the chip and packaging effect, this article uses three methods to make MiniLED chips of the same size, and then solder the chip and the substrate according to the corresponding temperature curve required for soldering, and then test and analyze the appearance, performance,

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A transparent substrate. It is proposed that PSSA substrate

A big challenge, which largely limits the further improvement of internal quantum efficiency. Two studies from Wuhan University have shown that PSSA substrates can perform better reflection and refraction functions than PSS substrates.

In contrast to the PSSA substrate, since the sidewalls of the silicon dioxide array cones do not form gallium nitride islands, the LED grown on the PSSA substrate can effectively reduce the contact between the sidewall area and the gallium nitride on the C-plane area of ​​the substrate. (Compiled by LEDinside Janice) Please indicate the source for reprinting! For more LED information, please follow the official website or search WeChat public account (LEDinside)..

In the flip-chip structure, light is mainly emitted through a transparent substrate. It is proposed that PSSA substrate can improve indium gallium nitride and gallium nitride ( InGaN/GaN) flip-chip visible light LED efficiency. In addition, based on the improvement of crystalline quality and light extraction efficiency, the external quantum efficiency of the flip-chip LED on the PSSA substrate is also higher than that of the flip-chip LED on the PSS substrate. Compared with the formal chip,

flip chip LED can solve the problems of heat dissipation and uneven current distribution. The mismatch problem that appears on the joint boundary. Earlier this year, Professor Zhou Shengjun, the head of the research team, proposed that the PSSA substrate can greatly improve the efficiency of indium gallium nitride and aluminum gallium nitride (InGaN/AlGaN) UV LEDs. Professor Zhou said that compared to the traditional PSS substrate solution, the silicon array in the flip-chip LED on the PSSA substrate has a smaller refractive index contrast led flood lights factory with air, so more light is refracted from the silicon array to the air

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LED has achieved a huge breakthrough in light efficiency

it ufo led high bay light manufacturers reduce the PN node to the surrounding environment. According to analysis, the development of LED indoor lighting in the next five years will have an exponential growth trend. The development of high-power LED lighting fixtures depends on two major elements: one is the chip itself; the other is lighting technology, including heat dissipation, optics, and driving. Thermal resistance can greatly reduce the PN node temperature of the LED, and successfully implement the goal of extending the life of the LED lamp and increasing the actual luminous flux.

Optical elements: Lens, reflector or light guide plate materials are necessary optical elements to focus light on the destination area. Although there are more and more LED lamp models and the luminous efficiency is constantly improving, the problem of high prices still exists.. In just a few years, with a series of technological improvements including chip structure, surface roughening treatment and multiple quantum well structure design,

LED has achieved a huge breakthrough in light efficiency. But when the price of LED light sources is reduced and the overall system design is optimized, the total cost will inevitably drop. In terms of the optical design of LED lighting fixtures, compared with traditional lamps, directivity and point light sources are the most typical characteristics of LEDs and are also the key to the optical design of lamps. It can also be used with some condensing lenses or reflectors to highlight the condensing effect of illuminated objects to achieve an ideal optical effect. The first is the chip.

The application of LED lighting fixtures has evolved from the past outdoor landscape lighting LED to indoor lighting applications. The base material has developed from traditional sapphire materials, silicon and silicon carbide to new materials such as zinc oxide and gallium nitride.

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The relevant technical specifications have been published

At present, the international ZHAGA alliance has attracted hundreds of manufacturers of lamps, light sources, LED modules and other industry-related companies from the United States, Asia and Europe, and they are already developing specifications and interface standards for LED lamps. It is committed to enhancing the compatibility of LED modules and their controls in terms of machinery, testing, and parameters.

The relevant technical specifications have been published and some have been revised many times. In China, Jiuzhou Optoelectronics and other companies led by the National Semiconductor Lighting Engineering Research and Development and Industry Alliance are also actively carrying out related work. Purchasing should be distinguished for the purpose of LED indoor lighting related color temperature can be divided into 3 groups, warm colors, intermediate colors, and cool colors are suitable for different places.

According to "GB 50034-2004 Architectural Lighting Design Standard", the relevant color temperature of indoor lighting sources can be divided into 3 groups, less than 3300K for warm colors, suitable for guest rooms, bedrooms, wards, bars, restaurants; 3300K～5300K for intermediate colors, suitable for offices , Classrooms, reading rooms, consultation rooms, inspection rooms, machining workshops, instrument assembly; more than 5300K is a cool color, suitable for thermal processing workshops and high-illuminance places.

It is China LED Wall Pack Light manufacturers in the "GB 50034-2004 Architectural Lighting Design Standard" that the color rendering index (Ra) of the lighting source should not be less than 80 in the room or place where you work or stay for a long time. In industrial construction sites where the installation height of lamps is greater than 6 meters,

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There are more considerations and flexibility in the design

'The Feasibility and Necessity of Online Testing of LED Lighting Products in Production' In one article.07 CFL bulb 37% 0. Figure 9: Complete time-domain and frequency-domain analysis of stroboscopic Figure 10: Measured waveforms of stroboscopic waveforms for commercially available LED bulbs. In the application of bulb lamps, in the past few years, LED bulbs have mostly adopted the design of half-circle light bulbs due to their component characteristics and heat dissipation design.

Percent Flicker is defined by the amplitude of the light waveform in the time domain, and Flicker Index is defined from the energy point of view. However, the Goniophotometer is not only bulky, but also takes about several hours for each measurement. The related definitions are shown in Figure 5. ,

There are more considerations and flexibility in the design; for example, ufo led high bay light manufacturers the LED driving method is different from the traditional light source, and the different driving circuit design also makes the performance of the LED light source greatly different.01 T8 bulb 28.70% 0. Figure 7 Bulb light shape online inspection-US Energy Star requirement example Figure 8 Light tube light shape online inspection-Japan JEL requirement example Table 2 All-peripheral light bulb Energy Star specification Measured sample quantity: 5000 all-peripheral light LED bulbs 135~ Percentage of lumens in the 180 degree area Max 7.

The reason why stroboscopic is the key point to be considered is that the stroboscopic phenomenon of traditional light sources is more consistent, while LEDs will be due to design choices and choices. Therefore, the amount of light measured by these multiple photodetectors can roughly depict the object under test.

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The internal quantum efficiency under extremely low temperature

In addition to significantly reducing manufacturing costs compared to existing LEDs, the new technology also makes it possible to use inorganic LEDs to produce large-area light-emitting elements like organic EL. (Editor in charge: Flora). The future issue is how to increase the internal quantum efficiency to a level equivalent to that of existing LEDs. In addition, the Fujioka Laboratory also developed the 'Pulse Excitation Deposition (PXD)' method on graphite sheets in 2008 Technology to form GaN crystals. Fujioka stated that he had been developing technologies for making LEDs by sputtering a long time ago,

'has not yet released the details of these technologies, just accumulating experience. Professor Fujioka’s laboratory transferred a graphene multilayer film on a glass substrate of about 2 inches (about 5 cm in diameter), and then formed AlN, n-type GaN, and n-type GaN on the graphene multilayer film by pulse sputtering. This time, GaN crystals were formed by sputtering on the graphene sheet, which can be called the thinnest graphite sheet, and it was confirmed that it can actually emit light. Related papers have been published 80w led street light suppliers in the academic journal 'ScientificReports'.

According to reports, LEDs that emit light in the three primary colors of red (R), green (G) and blue (B) have been produced. Professor Fujioka said, 'Compared with LEDs made on a sapphire substrate, the internal quantum efficiency is several percent lower.' . The internal quantum efficiency under extremely low temperature conditions is being evaluated.

The research office of Professor Hiro Fujioka of the University of Tokyo announced on June 23, 2014 that it has developed a technology for forming GaN-based LEDs on a glass substrate by sputtering.' . Quantum well and p-type GaN crystal composed of a multilayer structure of GaN and InGaN. At present, the luminous efficiency of white luminescence and the external quantum efficiency in a monochromatic state cannot be detected

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Complex shapes on the surface and difficult to omit by EDM

Therefore, in order to solve the problems of precision, surface quality and comprehensive mechanical properties of direct and rapid manufacturing of complex-shaped metal molds, it is necessary to explore new direct and rapid precision molding methods. 3. Outlook In view of the key position of mold technology in the manufacturing industry, rapid mold making, especially the development and research of rapid manufacturing metal mold technology, has received high attention. The key issues and development trends facing this technology have the following characteristics: 　　( 1) The use range of rapid soft molds and ceramic molds is limited.

The rapid manufacturing of led molds for die casting, injection molding, and stamping is the goal of RPN technology. (2) The indirect method, which combines various prototypes such as rapid prototyping and casting and spraying technologies, has an advantage in practicality compared to the direct method. However, due to the increase in processes and the influence of material properties and manufacturing environment, precision control is difficult Big. The key to improving the precision of indirect method is to develop molding materials with good dimensional stability, reduce molding procedures, and realize a stable working environment.　　(3)

The direct molding method based on the accumulation forming principle is still difficult to meet the requirements of high-precision, high-quality durable mold manufacturing in terms of surface and dimensional accuracy, comprehensive mechanical properties, and high cost and limited size specifications. The integration of accumulation and removal forming technology at low cost and suitable for fine processing and multiple material forming will be an effective method to improve the practicability, material adaptability and surface accuracy of the direct molding method.　　 (4)

The outdoor LED flood light manufacturers making method is suitable for my country's national conditions and has broad application prospects. Compared with high-speed milling, it has an advantage in the manufacture of metal molds with fine and complex shapes on the surface and difficult to omit by EDM. To further improve the competitiveness of rapid mold making technology, it is necessary to develop a new method of direct rapid mold making that is easier to generate processing data than numerical control processing data, and can obtain the required size and surface accuracy.

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